Zeston® Heat Transfer Compounds
Zeston® Heat Transfer Compounds were developed to provide a thermal bridge wherever external devices such as tracers or plate coils are used to maintain the temperature of material within process pipes or storage vessels. The use of these high quality compounds will greatly improve the efficiency of any tracing or plate coil system by replacing air with a solid compound that has a high thermal conductivity. Since conduction of heat and cold through a solid medium is more effective than by convection through air, more heat or cold is transferred to the pipe or vessel with the use of heat transfer compounds.
With Zeston Heat Transfer Compounds, "R" factors are exceptionally low, ranging from .043 to .086 (hr•ft2•°F)/Btu [0.008 to 0.015 m2•°C/W] (at 3/4" [19 mm] thickness). When Zeston Compounds are used around tracer lines and under plate coils, 360° (6.28 rad.) of the tracer or the entire plate coil surface is in effect, in physical contact with the pipe or vessel, via a thermal bridge. Practically, all the available heat is transferred to or away from the process equipment by the conductance of a low resistance medium and very little by convection via high resistance air.
A further improvement in performance is achieved from the flexibility inherent in a Zeston installation. Again, with standard installations, maximum performance can only be achieved by situating the bare tracer at the bottom (for heating) or top (for cooling) of the process line. With Zeston Compound, the tracer can be placed at the most convenient location, which can simplify installation and maintenance, helping to reduce costs. Frequently, less tracer equipment is required, and inspection and maintenance is greatly simplified.
PDF Downloads
